STMicroelectronics is working with research partners to develop a pilot line for next-generation MEMS devices augmented with advanced technologies such as piezoelectric or magnetic materials and 3D packaging. The project was launched by the European Nanoelectronics Initiative Advisory Council (ENIAC) Joint Undertaking (JU), a public-private partnership in nanoelectronics.
ST said this project will also develop advanced packaging technologies and vertical interconnections using flip-chip, through-silicon vias and through-mold vias, enabling 3D-integrated devices for applications such as body area sensors and remote monitoring. A key target is to perfect a PZT deposition process compatible with mass production, and integrate it into complex MEMS processes to enable innovative actuators and sensors on System-On-Chip industrial products.
