In Focus: Chiplet

Intel Foundry moved to accelerate industry momentum around modular semiconductor design this week by advancing its strategy for an open ...

Tenstorrent introduced the Open Chiplet Atlas (OCA) Ecosystem, an open framework designed to standardize and accelerate development across the emerging ...

lphawave Semi has completed the tape-out of its UCIe™ 3D chiplet IP on TSMC’s SoIC-X platform, delivering up to 10x ...

Arteris announced a collaboration with AMD to integrate its FlexGen Network-on-Chip (NoC) interconnect IP into AMD’s next-generation AI chiplet designs. ...

The Open Compute Project Foundation (OCP) has launched the OCP Chiplet Marketplace, marking a major step towards realizing the Open ...

At Hot Chips 2024, Intel presented a series of advancements across AI and compute technologies, including showcasing its integrated optical ...

The Universal Chiplet Interconnect Express (UCIe) Consortium has unveiled its 2.0 Specification, marking a significant advancement in the standardization of ...

Samsung Electronics has announced a significant partnership with Preferred Networks, a leading Japanese AI company, to provide cutting-edge semiconductor solutions. ...

Intel announced an integrated optical compute interconnect (OCI) chiplet co-packaged with an Intel CPU, representing a leap forward in high-bandwidth ...

Rapidus, headquartered in Tokyo, and IBM  announced a partnership focused on 2nm chiplet packaging technology. Rapidus will leverage IBM's advanced ...

Alphawave Semi demonstrated its first connectivity silicon platform on TSMC’s most advanced 3nm process with its ZeusCORE Extra-Long-Reach (XLR) 1-112Gbps ...

What will it take to create a vibrant ecosystem where innovative chipset designs can easily be integrated with other semiconductors ...

The OCP Foundation released its Bunch of Wires (BoW) specification for Chiplet interconnect, representing a next step in the OCP ...