OCP targets standard for GPU management
At OCP Summit in San Jose, Microsoft announced a collaborative effort with AMD, Google, Meta, and NVIDIA to create OCP ...
In Focus: OCP
🏛️ Open Compute Project (OCP) Open Hardware Collaboration for Hyperscale and AI Infrastructure | |
| The Open Compute Project (OCP) is an industry organization focused on open designs and specifications for data center infrastructure, including servers, networking, storage, power, cooling, racks and AI systems. OCP brings together hyperscalers, equipment vendors, semiconductor companies and infrastructure operators to accelerate open innovation across large-scale computing environments. | |
| Why It Matters | AI infrastructure is pushing data center architectures toward higher density, greater power demand and new networking requirements. OCP provides a neutral forum where the industry can define open hardware and system-level approaches for hyperscale cloud and AI deployments. |
| Category | Industry Consortium |
| Mission | Advance open hardware, system design and infrastructure specifications for scalable, efficient and interoperable data centers. |
| Focus Areas | AI infrastructure • Data center networking • Open hardware • Power and cooling • Rack-scale systems • Optical interconnects • Cloud infrastructure |
| Key Members | Google • Meta • Microsoft • NVIDIA • Intel • AMD • Broadcom • Cisco |
| Related Technologies | AI Infrastructure • MRC • Ultra Ethernet • Co-Packaged Optics |
| Related Organizations | Linux Foundation • OIF • Ultra Ethernet Consortium |
OCP launches Security Appraisal Framework and Enablement program
The Open Compute Project Foundation (OCP) has launched a new Security Appraisal Framework and Enablement (S.A.F.E.) program aimed at improving ...
AI is Open Compute Project’s Biggest Challenge Yet
Check out OCP Summit 2023 videos here: https://ngi.fyi/ocpsummit23yt Is AI the biggest challenge for the Open Compute Project (OCP)? Zaid ...
OCP and Ultra Ethernet Consortium team on AI Clusters
The Open Compute Project Foundation (OCP) and the Ultra Ethernet Consortium (UEC) announced a new collaboration to improve Ethernet performance ...
OCP releases chiplet interconnect link layer spec and BoW 2.0
The Open Compute Project Foundation (OCP) released of a new chiplet interconnect link layer specification and an evolution of its ...
AWS contributes New Edge Gateway spec to OCP
AWS has contributed a new edge gateway base specification to the Open Compute Project The spec is targeted for deployments ...
OCP Switch Abstraction Interface moves under Linux Foundation’s DENT network OS Project
The Linux Foundation (LF) announced the incorporation of the Open Compute Switch Abstraction Interface (SAI) into the open source DENT ...
Bunch of Wires (BoW) Die-to-Die Chiplet Demo
At the first, annual Chiplet Summit in San Jose, California, d-Matrix demonstrated a die-to-die chipset interface based on the emerging ...
Building a new Chiplet Economy
What will it take to create a vibrant ecosystem where innovative chipset designs can easily be integrated with other semiconductors ...
What’s next at OCP in 2023?
From immersion cooling, to optical switching, and disaggregated systems there are a lot of new technologies arriving at the Open ...
OCP: Introducing CXL Memory Pooling
https://youtu.be/3TsYgWaKGuUAstera Labs has demonstrated the industry's first CXL memory pooling solution to reduce memory stranding, optimize memory utilization and reduce ...
OCP: Smarter chassis designs for sustainable data centers
Inspur showcased four Open Compute Project (OCP) certified systems at #OCPSummit2022 with a focus on data center sustainability, such as ...
OCP: Massive power efficiency gains for tape vs HDDs
https://youtu.be/5NAr3YPilM8 IBM unveiled its Diamondback Tape Library, a high-density archival storage solution that is physically air-gapped to help protect against ...
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