DISH Wireless picks Samsung for 5G Open RAN rollout

DISH Network has selected Samsung Networks for the deployment of 5G O-RAN-compliant virtualized RAN (vRAN) solutions and radio units in ...

Virgin Media O2 installs Samsung at multiple 4G/5G sites

4 years ago

Virgin Media O2 has completed the deployment of Samsung gear at multiple live 4G and 5G sites in the U.K. ...

Howard University builds a CBRS network with Samsung + Amdocs

4 years ago

Howard University has deployed a 5G-ready network using CBRS specturm to deliver secure and enhanced broadband connectivity to students, faculty ...

Samsung debuts flagship Exynos 2200 mobile processor

4 years ago

Samsung Electronics Co. announced mass production of its flagship Exynos 2200 premium mobile processor produced using 4-nanometer (nm) EUV (extreme ...

Samsung demos first MRAM based in-memory computing

4 years ago

Samsung Electronics Co. announced the first demonstration of in-memory computing based on MRAM (Magnetoresistive Random Access Memory). In memory computing differs ...

Samsung’s new enterprise PCIe 5.0 SSD reads at up to 13,000 MB/sec

4 years ago

Samsung Electronics introduced its next-gen, enterprise SSDs integrating the PCIe 5.0 interface with its own sixth-generation V-NAND.Samsung said its new ...

IBM and Samsung unveil Vertical Transport Field Effect Transistors

4 years ago

IBM and Samsung Electronics unveiled a new class of Vertical Transport Field Effect Transistors (VTFET) - a breakthrough the companies ...

Samsung ramps up automotive memory chips for EVs

4 years ago

Samsung Electronics unveiled a portfolio of automotive memory solutions designed for next-generation autonomous electric vehicles. The new lineup includes a ...

Samsung intros three automotive chips

5 years ago

Samsung Electronics Co. introduced three of its latest automotive chip solutions: the Exynos Auto T5123 for 5G connectivity, the Exynos ...

Inspur and Samsung build open storage solution for OCP

5 years ago

Inspur Information, which ranks among the world’s top 3 server manufacturers, and Samsung announced a Poseidon V2 E3.x reference system ...

Samsung announces 2.5F Hybrid-Substrate Cube packaging

5 years ago

Samsung Electronics introduced Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, ...