Samsung begins chip production using 3nm process
Samsung Electronics confirmed initial production of its 3-nanometer (nm) process node applying Gate-All-Around (GAA) transistor architecture. The company is starting ...
Samsung Electronics confirmed initial production of its 3-nanometer (nm) process node applying Gate-All-Around (GAA) transistor architecture. The company is starting ...
Samsung Electronics and Red Hat are collaborating on software for next-generation memory solutions. The newly announced partnership will focus on the ...
DISH Network has selected Samsung Networks for the deployment of 5G O-RAN-compliant virtualized RAN (vRAN) solutions and radio units in ...
Virgin Media O2 has completed the deployment of Samsung gear at multiple live 4G and 5G sites in the U.K. ...
Howard University has deployed a 5G-ready network using CBRS specturm to deliver secure and enhanced broadband connectivity to students, faculty ...
Samsung Electronics Co. announced mass production of its flagship Exynos 2200 premium mobile processor produced using 4-nanometer (nm) EUV (extreme ...
Samsung Electronics Co. announced the first demonstration of in-memory computing based on MRAM (Magnetoresistive Random Access Memory). In memory computing differs ...
Samsung Electronics introduced its next-gen, enterprise SSDs integrating the PCIe 5.0 interface with its own sixth-generation V-NAND.Samsung said its new ...
IBM and Samsung Electronics unveiled a new class of Vertical Transport Field Effect Transistors (VTFET) - a breakthrough the companies ...
Samsung Electronics unveiled a portfolio of automotive memory solutions designed for next-generation autonomous electric vehicles. The new lineup includes a ...
Samsung Electronics Co. introduced three of its latest automotive chip solutions: the Exynos Auto T5123 for 5G connectivity, the Exynos ...
Inspur Information, which ranks among the world’s top 3 server manufacturers, and Samsung announced a Poseidon V2 E3.x reference system ...
Samsung Electronics introduced Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, ...
© 2026 Converge Digest - A private dossier for networking and telecoms.
© 2026 Converge Digest - A private dossier for networking and telecoms.