• Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Wednesday, June 10, 2026
  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » Tower Semi to Manufacture Salience Labs’ PIC-Based Optical Circuit Switches

Tower Semi to Manufacture Salience Labs’ PIC-Based Optical Circuit Switches

February 25, 2026
in All
A A

Salience Labs is partnering with Tower Semiconductor to move photonic integrated circuit (PIC)-based optical circuit switches into pre-production, targeting large-scale AI data center deployments. The companies will manufacture optical circuit switch (OCS) devices using Tower’s silicon photonics platforms, including PH18DA with integrated III-V lasers and TPS45PH featuring low-loss silicon nitride waveguides.

The collaboration focuses on shifting switching functions deeper into the optical domain to reduce latency, power consumption, and electrical bottlenecks in AI clusters. Optical circuit switching offers an alternative to traditional optical-electrical-optical (OEO) conversion and electronic packet switching (EPS) architectures, which can introduce added latency and energy overhead in large-scale AI back-end networks. Dell’Oro Group projects that AI-driven data center switch spending will exceed $100 billion by 2030, reflecting accelerating investments across scale-up, scale-out, and scale-across architectures.

Salience Labs, founded in 2021 and building on research from the University of Oxford and the University of Münster, develops photonic switching technologies designed to support high-bandwidth, ultra-low latency interconnect fabrics. Tower Semiconductor, a specialty foundry with 200 mm and 300 mm fabs in Israel, the U.S., Japan, and Italy, will provide high-volume silicon photonics manufacturing to support industrialization and volume production of the OCS devices.

• Partnership targets PIC-based optical circuit switches for AI data centers

• Manufacturing leverages Tower’s PH18DA (with integrated III-V lasers) and TPS45PH (low-loss silicon nitride) platforms

• Focus on reducing OEO conversions and minimizing electrical bottlenecks

• Pre-production phase underway, with path to volume manufacturing

• AI back-end network switch spending projected to exceed $100 billion by 2030

“Silicon photonics with integrated light sources is a key enabler for scaling next-generation optical connectivity, and our collaboration with Salience Labs reinforces our strong momentum in AI and data-center infrastructure,” said Dr. Ed Preisler, Vice President and General Manager of RF Business Unit, Tower Semiconductor.

🌐  Analysis: Optical circuit switching has re-emerged as AI cluster topologies push the limits of electrical switching fabrics and pluggable optics. By combining integrated lasers and low-loss waveguides in a foundry-ready platform, the partnership positions Salience Labs to compete in a field that includes optical switching efforts from established silicon photonics vendors and hyperscaler-backed startups. The move into pre-production also reflects broader industry momentum toward co-packaged optics and photonic fabrics as AI networks scale beyond traditional leaf-spine designs.

Salience Labs is a UK-based photonic networking startup focused on optical circuit switching (OCS) for AI data center fabrics. Founded in 2021, the company emerged from more than a decade of academic research at the University of Oxford (UK) and the University of Münster (Germany), targeting a fundamental bottleneck in large-scale AI clusters: the latency, power, and scaling constraints of electronic packet switching.

The company positions its architecture as a shift from traditional optical-electrical-optical (OEO) conversion toward direct optical-domain switching. Rather than converting light to electrical signals at each switching stage, Salience integrates switching functions within photonic integrated circuits (PICs), aiming to reduce energy per bit and eliminate electrical bottlenecks in back-end AI networks. The design targets scale-up, scale-out, and emerging scale-across cluster architectures that hyperscalers deploy for large language models and distributed AI training. The intellectual foundation centers on silicon photonics device engineering, low-loss waveguide integration, and scalable switching fabrics capable of supporting high-radix optical connectivity.

ShareTweetShareSummarizeSummarize
Previous Post

AMD Invests $250M in Nutanix to Build Open Agentic AI Infrastructure Platform

Next Post

1Finity Launches Open 800G+ Optical Line System for AI-Scale Networks

Jim Carroll

Jim Carroll

Editor and Publisher, Converge! Network Digest, Optical Networks Daily - Covering the full stack of network convergence from Silicon Valley

Related Posts

Optical

Colt and Ciena Achieve 800GbE Quantum-Safe Across the Atlantic

June 10, 2026
All

AWS Launches Graviton5 CPU with 192 Cores for Agentic AI

June 10, 2026
Research

Dell’Oro: AI Infrastructure Spending Pushes 2026 Data Center Capex Above $1 Trillion

June 10, 2026
Semiconductors

TDK Acquires Fabric8Labs to Scale Advanced Cooling for AI Data Centers

June 10, 2026
Quantum

Xanadu Sets New Benchmark for Ultra-Low-Loss Photonic Chip Packaging

June 10, 2026
Research

Dell’Oro: Campus Ethernet Switch Revenue Climbs in 1Q 2026

June 10, 2026
Next Post

1Finity Launches Open 800G+ Optical Line System for AI-Scale Networks

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io

© 2026 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io

© 2026 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version