Marvell: AI Infrastructure Bottlenecks Shift from Compute to Connectivity At the Optica Executive Forum, Dave Lazovsky, EVP and GM of the Data Center Networking Group at Marvell Technology, argued that...
Broadcom Outlines Optical Scale-Up Strategy for AI Fabrics, Backs New OCI MSA At the Optica Executive Forum in Los Angeles on Monday, Broadcom’s Near Margalit argued that the next phase...
A new Multi-Source Agreement (MSA) focused on multicore fiber (MCF) has emerged as hyperscale operators push toward higher fiber density and more efficient scale-out architectures. Announced on March 11, 2026,...
Richard Ho, Head of Hardware at OpenAI, opened his keynote at the Optica Executive Forum in Los Angeles with a clear message: the future of AI will be determined not...
At the Optica Executive Forum in Los Angeles, Meta’s Drew Alduino laid out the sheer scale and complexity of building AI infrastructure at hyperscale, emphasizing that while optical technologies like...
LOS ANGELES — The scale of optical connectivity required for future AI infrastructure may be far larger than the industry currently expects, according to Andy Bechtolsheim, co-founder and CTO of...
NVIDIA introduced its BlueField-4 STX reference architecture at GTC 2026, targeting a fundamental bottleneck in AI infrastructure: storage performance for long-context, agentic AI workloads. The new design focuses on accelerating...
Frore Systems announced a $143 million Series D funding round, reaching a $1.64 billion valuation as demand for advanced cooling solutions intensifies alongside the global buildout of AI infrastructure. The...
Satya Nadella, CEO of Microsoft, confirmed on X that the company has brought up an NVIDIA Vera Rubin NVL72 system for validation inside its cloud infrastructure. Nadella wrote that Azure...
A group of optical connectivity vendors including Ciena, Coherent, Marvell, Molex, Samtec, and TeraHop announced the formation of the Open CPX MSA, a new industry initiative focused on defining common...
NewPhotonics unveiled the NPG10240, a 3.2 Tbps DR8 transmitter-on-chip photonic integrated circuit (PIC) featuring integrated lasers, 448 Gbps modulators, and the company’s OSPic optical signal processor. The device targets next-generation...
VIAVI Solutions announced the TestCenter D2 1.6T Appliance, a new Ethernet test platform designed to validate next-generation AI data center networks operating at 1.6T speeds. The system targets hyperscalers, cloud...
Lightmatter introduced vClick Optics, a detachable fiber array unit for co-packaged optics that targets one of the toughest manufacturing problems in advanced AI packages: how to connect fiber to photonic...
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