Huawei upgraded its 5G-Advanced (5G-A) mobile transport portfolio in Barcelona with a new Fiber Health Care (FHC) solution that embeds optical diagnostics directly into the network. The system integrates built-in...
TensorWave teamed up with Credo Technology Group to deploy Credo’s ZeroFlap (ZF) Active Electrical Cables (AECs) and optical transceivers across TensorWave’s next-generation AMD-based AI cluster builds. Credo said the design...
Singapore-based PhotonIC Technologies introduced a product portfolio built on its Resiliency of Optoelectronic Chip Supply-Chain (ROCS) platform, positioning the approach as a way for module and system vendors to diversify...
Ciena introduced its Vesta 200 6.4T CPX pluggable co-packaged optical (CPO) engine, targeting hyperscale AI data centers that require higher density and lower power at 200G per lane. The launch...
IP Infusion introduced OcNOS 7.0 at Mobile World Congress 2026 in Barcelona, positioning the new release as a platform for AI data center fabrics and open converged IP/optical transport at...
1Finity, a Fujitsu company, introduced its Ultra Optical System L1000/L2000, a next-generation open optical line system (OLS) designed to support 800G and higher-capacity transport for AI-driven networks. The platform targets...
Ayar Labs named Sankara Venkateswaran as Vice President of Engineering, strengthening its leadership team as it pushes co-packaged optics (CPO) into high-volume production for hyperscale AI infrastructure. The San Jose–based...
Hakusan, SANWA Technologies and US Conec have signed agreements to expand multi-sourcing and development of MMC Very Small Form Factor (VSFF) multi-fiber optical connector and TMT ferrule solutions, targeting hyperscale...
Meta is expanding its AI infrastructure through a multiyear, multigenerational partnership with NVIDIA, deploying millions of Blackwell and Rubin GPUs alongside NVIDIA CPUs and Spectrum-X networking across its global data center...
Molex introduced its Impress Co-Packaged Copper Solutions, targeting next-generation AI servers and high-density data center systems operating at 224Gbps PAM-4 and higher. The Lisle, Illinois-based connectivity supplier designed Impress as...
Tower Semiconductor and Scintil Photonics introduced what they describe as the first heterogeneously integrated DWDM laser sources designed for AI infrastructure, combining monolithic laser integration with high-volume silicon photonics manufacturing. The companies said...
GlobalFoundries (GF) reported fourth-quarter 2025 revenue of $1.83 billion and highlighted silicon photonics, advanced packaging, and GaN power as central growth engines tied to AI data center buildouts. Communications infrastructure...
Tower Semiconductor reported record fourth quarter 2025 revenue of $440 million, up 14% year-over-year and 11% sequentially, as demand for silicon photonics (SiPho) and SiGe platforms accelerated. The company delivered...
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