Marvell introduced a high-performance, 1.6T PAM4 DSP for active electrical cables (AECs) designed for the greater connectivity bandwidth requirements between AI accelerators, server to top-of-rack links and switch-to-switch interconnects within...
Etched.ai, a start-up based in Cupertino, California, has introduced its Sohu ASIC, a specialized chip designed specifically for transformer architecture-based artificial intelligence models. According to the company, Sohu is capable...
Intel announced an integrated optical compute interconnect (OCI) chiplet co-packaged with an Intel CPU, representing a leap forward in high-bandwidth interconnect by enabling co-packaged optical input/output (I/O) in emerging AI...
Cadence Design Systems introduced its Janus Network-on-Chip (NoC) technology for managing data delivery between silicon components in complex SoCs and disaggregated multi-chip systems. The Cadence Janus NoC manages these simultaneous...
Intel Foundry reported progress from several ecosystem partners on its Embedded Multi-die Interconnect Bridge (EMIB) technology, which is designed used to connect multiple silicon dies within a single package, allowing...
Ceva has extended its Ceva-NeuPro family of Edge AI NPUs by introducing the Ceva-NeuPro-Nano NPUs. These highly-efficient, self-sufficient NPUs are designed to deliver the power, performance, and cost efficiencies required...
Tenstorrent has licensed Baya Systems’ customizable WeaveIP fabric to scale its AI and RISC-V chiplet solutions. Baya’s IP and software flow enables Tenstorrent and its partners to analyze, customize and...
Neoconix has begun shipping its latest board-to-board array connectors, the “Mini” (CBM) and SPH3 “Ultra,” powered by innovative C-Beam™ technology. These connectors are designed to support high-speed data rates of...
Renesas Electronics has acquired Transphorm (Nasdaq: TGAN), a supplier of gallium nitride (GaN) power semiconductors. With this acquisition, Renesas will immediately begin offering GaN-based power products and related reference designs...
Alphawave Semi has announced a 9.2 Gbps HBM3E sub-system (PHY + Controller IP) silicon platform, achieving an unprecedented memory bandwidth of 1.2 Terabytes per second (TBps) through chiplet-enabled technology. In...
Astera Labs has demonstrated end-to-end PCIe optical connectivity to provide unprecedented reach for larger, disaggregated GPU clusters. The company’s technology for PCIe over optics expands its Aries family of Smart...
onsemi announced plans to establish a state-of-the-art, vertically integrated silicon carbide (SiC) manufacturing facility in the Czech Republic to produce intelligent power semiconductors for use in electric vehicles, renewable energy...
NVIDIA has achieved a remarkable milestone by more than tripling the performance on the large language model (LLM) benchmark, based on GPT-3 175B, compared to its record-setting submission from last...
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