Semiconductors

Upscale AI announced a $190 million Series A-1 financing extension, bringing its total funding to $500 million and valuing the company at $2 billion. The round was led by Premji...

Micron Technology and Anthropic announced a broad strategic agreement that links AI model development directly to memory and storage infrastructure design. The collaboration spans joint architecture work on AI memory and storage...

Intel is positioning advanced packaging as a central pillar of its foundry strategy, outlining how its Embedded Multi-die Interconnect Bridge (EMIB) technology can enable AI accelerators, networking silicon, and high-performance...

Synopsys has introduced the first commercial products that combine its electronic design automation (EDA) software with Ansys multiphysics technology, marking a significant milestone less than a year after closing its...

SandboxAQ announced a definitive agreement with the U.S. Department of Commerce’s CHIPS Research and Development Office for a $500 million award aimed at reducing U.S. dependence on foreign-controlled materials and...

Tensordyne, a startup headquartered in Sunnyvale, California and Munich, Germany, announced the successful tape-out of its 3nm Napier AI inference processor and unveiled a rack-scale inference architecture that the company...

AMD has acquired MEXT, a startup specializing in AI-driven memory optimization software designed to improve memory efficiency across modern compute infrastructure. The move expands AMD’s AI and data center portfolio...

Baya Systems and Openchip have announced a strategic partnership focused on developing next-generation AI and high-performance computing systems built around advanced data movement architectures. Under the agreement, Openchip has licensed...

TDK Corporation has agreed to acquire Fabric8Labs, a San Diego-based developer of Electrochemical Additive Manufacturing (ECAM) technology, in a move aimed at scaling production of advanced thermal management, power delivery,...

Xanadu announced a new milestone in photonic chip packaging, achieving an average edge-coupling loss of just 0.085 dB per facet for its integrated photonic chips. The result addresses one of...

Micron Technology selected Bechtel as its engineering, procurement and construction (EPC) partner for the first phase of the company’s leading-edge memory manufacturing complex in Clay, New York. The move advances...

GlobalFoundries and Qualinx completed the first fully European-based, end-to-end semiconductor manufacturing flow at GF’s Dresden fab, marking a step toward trusted chip production for aerospace, defense, critical infrastructure, IoT and...

Broadcom, Apollo, and Blackstone Launch AI XPV Platform San Jose, CA & New York, NY — Broadcom Inc. has announced a landmark strategic financing initiative with alternative asset giants Apollo...