Silicon for AI, Cloud, Telecom and Digital Infrastructure Converge Digest tracks the semiconductor platforms powering next-generation networks, AI clusters, optical systems, data centers, wireless infrastructure and edge devices. |
Silicon Pillars AI AcceleratorsNetworking SiliconOptical DSPsChipletsMemorySilicon PhotonicsWireless SoCs |
| Tracking: Tapeouts • Process Nodes • Packaging • Foundry Partnerships • AI Inference • Ethernet Switching • Coherent Optics • Memory Bandwidth • Power Efficiency • Supply Chain |
Texas Instruments agreed to acquire Silicon Labs in an all-cash transaction valued at approximately $7.5 billion, strengthening its position in embedded wireless connectivity. The deal, announced February 4, 2026, values...
Siemens has acquired Canopus AI to expand its electronic design automation (EDA) software portfolio with AI-driven computational metrology and inspection. The deal, which closed on January 12, 2026, strengthens Siemens’ semiconductor manufacturing digital...
Advanced Micro Devices reported record fourth-quarter and full-year 2025 financial results on February 3, underscoring continued momentum across its data center, client, and AI businesses. Fourth-quarter revenue reached $10.3 billion, up...
Broadcom introduced the industry’s first enterprise Wi-Fi 8 access point and switching solution built on a unified silicon architecture, extending its Wi-Fi 8 roadmap first previewed in October 2025. The platform...
Intel Corp. announced a collaboration with SAIMEMORY, a subsidiary of SoftBank Corp., to develop a new stacked memory technology known as Z-Angle Memory (ZAM). The initiative targets next-generation memory architectures...
Tokyo-based THine Electronics announced a DSP-free optical chipset built around its ZERO EYE SKEW technology, targeting short-reach optical interconnects for PCI Express 6 and 7 in linear pluggable optics (LPO)...
Micron Technology broke ground on a new advanced wafer fabrication facility in Singapore, committing approximately $24 billion over the next decade to expand NAND manufacturing capacity. The facility, located within...
Credo introduced the Blue Heron 224G AI scale-up retimer, positioning it as the industry’s first multiprotocol 224G retimer designed to support UALink, Ethernet for Scale-Up Networking (ESUN), and Ethernet. The...
Lightmatter and Synopsys announced a collaboration to integrate Synopsys’ 224G SerDes and UCIe IP, qualified for a 3nm process, into Lightmatter’s Passage 3D co-packaged optics (CPO) platform. The companies are targeting hyperscale AI...
Lightmatter announced a technical collaboration with Cadence to develop co-packaged optics (CPO) solutions that combine Cadence’s silicon-proven high-speed SerDes and UCIe IP with Lightmatter’s Passage optical engine. The effort targets hyperscale AI and...
Lightmatter and Global Unichip Corp. (GUC) announced a strategic partnership to bring commercial Passage 3D co-packaged optics (CPO) solutions to market for hyperscale AI and high-performance computing environments. The collaboration combines Lightmatter’s silicon...
Microsoft CEO Satya Nadella confirmed that the company’s latest in-house AI accelerator, Maia 200, is now live in Azure, expanding Microsoft’s portfolio of CPUs, GPUs, and custom silicon available to cloud customers....
Astera Labs announced an expanded roadmap for its Scorpio X-Series Smart Fabric Switches as hyperscalers push scale-up architectures to support rapidly growing AI clusters. The company said Scorpio X-Series has...
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