Semiconductors

Silicon solutions for data centers, network infrastructure, and CPE

Cadence Launches Chiplet Partner Ecosystem

Cadence unveiled a new Chiplet Spec-to-Packaged Parts ecosystem aimed at reducing engineering complexity and accelerating time to market for customers building chiplets for physical AI, data center, and high-performance computing (HPC)...

NXP Unveils eIQ Agentic AI Framework

NXP Semiconductors introduced a new software layer for edge intelligence with the launch of its eIQ Agentic AI Framework, extending its edge AI platform to support autonomous, agent-based decision making directly...

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