Semiconductors

Point2 Technology, a Silicon Valley startup developing RF-based interconnect solutions for AI infrastructure, secured an extension to its Series B funding round led by Maverick Silicon, with participation from NVentures...

Syenta, an Australia-founded semiconductor startup focused on advanced packaging, raised $26 million in Series A funding to commercialize its chip-to-chip interconnect technology for AI systems. The round was led by...

SambaNova Systems has signed a distribution and deployment agreement with TEPCO Systems Corporation to deliver energy-efficient AI infrastructure across Japan. The deal positions TEPCO Systems as both a reseller and operator, using...

Cerebras Systems filed an S-1 registration with the Securities and Exchange Commission (SEC), offering a detailed look at one of the most ambitious alternative architectures in AI infrastructure. The IPO...

Sequoia Capital is backing a new semiconductor startup, Nuvacore, that has just emerged from stealth with plans to develop a general-purpose CPU architecture optimized for AI-era workloads. The company positions...

Teradyne announced the acquisition of TestInsight, a provider of semiconductor test development and validation software, to strengthen its position in design-to-test workflows for AI and data center devices. Financial terms...

Broadcom notched another major hyperscaler design win as Meta expanded its partnership to co-develop multiple generations of MTIA (Meta Training and Inference Accelerator) silicon, deepening Broadcom’s role across chip design, advanced packaging,...

Rebellions, Arm, and SK Telecom announced a joint initiative to develop AI inference infrastructure tailored for sovereign AI and telecommunications data center environments. The collaboration centers on integrating Arm’s forthcoming AGI CPU—its first...

Intel and Google expanded a multiyear collaboration aimed at the next phase of AI and cloud infrastructure, with Intel Xeon CPUs continuing to power parts of Google Cloud and the...

SiFive secured $400 million in an oversubscribed Series G funding round to accelerate development of high-performance RISC-V CPU and AI IP targeting data center deployments. The round, led by Atreides Management, included...

Altera announced plans to extend lifecycle support for its Agilex, MAX 10, and Cyclone V FPGA families through 2045, targeting customers deploying long-lived infrastructure across industrial, aerospace, communications, and transportation sectors....

Coherent Corp. introduced new silicon carbide (SiC) thick epitaxy capabilities designed to support power devices operating up to 10kV, targeting next-generation AI data centers and high-voltage industrial systems. The announcement reflects...

SambaNova Systems and Intel unveiled a production-scale heterogeneous AI infrastructure design that combines GPUs, SambaNova RDUs, and Intel Xeon 6 CPUs to address the performance bottlenecks emerging in agentic AI workloads. The...