Silicon for AI, Cloud, Telecom and Digital Infrastructure Converge Digest tracks the semiconductor platforms powering next-generation networks, AI clusters, optical systems, data centers, wireless infrastructure and edge devices. |
Silicon Pillars AI AcceleratorsNetworking SiliconOptical DSPsChipletsMemorySilicon PhotonicsWireless SoCs |
| Tracking: Tapeouts • Process Nodes • Packaging • Foundry Partnerships • AI Inference • Ethernet Switching • Coherent Optics • Memory Bandwidth • Power Efficiency • Supply Chain |
Broadcom, Apollo, and Blackstone Launch AI XPV Platform San Jose, CA & New York, NY — Broadcom Inc. has announced a landmark strategic financing initiative with alternative asset giants Apollo...
Microchip Technology introduced TimePictra 12, a major upgrade to its synchronization management software designed for telecommunications networks, utilities, transportation systems, data centers, and AI infrastructure. The new release expands support...
Cadence and Intel Foundry announced a multi-year expansion of their collaboration aimed at accelerating design technology co-optimization (DTCO) for Intel’s next-generation manufacturing processes, beginning with Intel 14A. The agreement combines...
MACOM Technology Solutions has announced a new chip-scale hot via process built on its proprietary AlGaAs diode technology. Designed as an alternative to traditional chip-and-wire bonding and copper pillar-based surface-mount technologies (SMT), the hot...
Marvell Chairman and CEO Matt Murphy used his COMPUTEX keynote in Taiwan to argue that the next defining bottleneck in AI infrastructure is no longer compute or memory alone, but...
Atomera announced new test results showing that its Mears Silicon Technology (MST) can address a longstanding challenge that has limited the adoption of gallium nitride (GaN) devices on silicon substrates...
GlobalFoundries (GF) has joined the U.S. Department of Energy’s Genesis Mission as an industry partner, providing researchers with direct access to semiconductor manufacturing resources intended to accelerate the transition from...
xLight has finalized a $150 million award under the U.S. CHIPS and Science Act to support construction and demonstration of its first free-electron laser (FEL) system for semiconductor manufacturing. The...
Marvell introduced its Teralynx T100, a 102.4 Tbps Ethernet switch silicon platform aimed squarely at the rapidly growing AI infrastructure market. The company says the device is the industry’s first...
XCENA raised $135 million in Series B funding to expand deployment of its memory-centric computing platform for AI infrastructure. The round brings total funding to $185 million and values the...
FuriosaAI announced a strategic partnership with Broadcom to develop a third-generation AI accelerator platform built around a multi-die chiplet architecture optimized for large-scale inference workloads. The collaboration combines FuriosaAI’s Tensor...
Broadcom introduced a fixed wireless access reference platform with Samsung Electronics that combines Broadcom’s BCM6776 Wi-Fi 8 SoC with Samsung’s B1320 5G modem. The platform targets global FWA gateways and...
Broadcom introduced the BCM68850, a 50G ITU-PON home gateway SoC with an integrated neural processing unit and native Wi-Fi 8 compatibility, targeting the next generation of fiber broadband gateways. The...
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