Broadcom Adds 50G PON Edge AI Gateway SoC
Broadcom introduced the BCM68850, a 50G ITU-PON home gateway SoC with an integrated neural processing unit and native Wi-Fi 8 compatibility, targeting the next generation of fiber broadband gateways. The...
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Silicon for AI, Cloud, Telecom and Digital Infrastructure Converge Digest tracks the semiconductor platforms powering next-generation networks, AI clusters, optical systems, data centers, wireless infrastructure and edge devices. |
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| Tracking: Tapeouts • Process Nodes • Packaging • Foundry Partnerships • AI Inference • Ethernet Switching • Coherent Optics • Memory Bandwidth • Power Efficiency • Supply Chain |
Broadcom introduced the BCM68850, a 50G ITU-PON home gateway SoC with an integrated neural processing unit and native Wi-Fi 8 compatibility, targeting the next generation of fiber broadband gateways. The...
Amkor Technology is expanding its U.S. advanced packaging footprint with the acquisition of an additional 67-acre parcel adjacent to its semiconductor packaging and test campus in Peoria, Arizona. The move...
Broadcom will join Applied Materials’ EPIC (Equipment and Process Innovation and Commercialization) platform as an innovation partner focused on accelerating advanced semiconductor packaging technologies for next-generation AI systems. The collaboration...
Credo and Rebellions are partnering to integrate Credo’s ZeroFlap active electrical cables (AECs) into Rebellions’ RebelPOD AI inference clusters, targeting enterprises building scalable AI inference infrastructure. The companies said the...
Analog Devices announced plans to acquire Empower Semiconductor in a $1.5 billion all-cash transaction aimed at strengthening its position in high-density power delivery systems for AI infrastructure. The deal expands...
MaxLinear introduced two new USB-to-UART device families aimed at the growing control-plane infrastructure requirements of AI data centers. The new Coronado™ (MxL81424) and Laguna™ (MxL81108) product lines target console access,...
Canada’s FABrIC semiconductor initiative awarded more than C$10.7 million (US$7.8 million) in federal funding to support 11 industry-led semiconductor and photonics projects targeting Edge AI, optical interconnects, sensing, and low-power...
Tower Semiconductor reported strong Q1 2026 financial results driven by accelerating demand for silicon photonics used in AI infrastructure, while simultaneously disclosing $1.3 billion in contracted silicon photonics revenue for...
Fractile raised $220 million in Series B funding to accelerate development and commercialization of its AI inference chips and systems, targeting the latency and cost limits that now shape frontier...
MinIO introduced MemKV, a new context memory store designed to accelerate AI inference by delivering microsecond-scale context retrieval across petabyte-scale infrastructure. The announcement expands MinIO’s AI infrastructure portfolio beyond its...
AMD reported first quarter 2026 revenue of $10.3 billion, up 38% year-over-year, as demand for EPYC CPUs and Instinct GPUs pushed Data Center revenue to $5.8 billion. The company said...
Astera Labs introduced its Scorpio X-Series 320-lane Smart Fabric Switch, positioning it as a high-radix, memory-semantic interconnect designed to support large-scale AI clusters with reduced latency and improved efficiency. The...
Veeco Instruments announced more than $250 million in equipment orders tied to the production of Indium Phosphide (InP) lasers used in high-speed optical transceivers for AI data center infrastructure. The...
© 2026 Converge Digest - A private dossier for networking and telecoms.
© 2026 Converge Digest - A private dossier for networking and telecoms.