Altera announced plans to extend lifecycle support for its Agilex, MAX 10, and Cyclone V FPGA families through 2045, targeting customers deploying long-lived infrastructure across industrial, aerospace, communications, and transportation sectors....
Coherent Corp. introduced new silicon carbide (SiC) thick epitaxy capabilities designed to support power devices operating up to 10kV, targeting next-generation AI data centers and high-voltage industrial systems. The announcement reflects...
SambaNova Systems and Intel unveiled a production-scale heterogeneous AI infrastructure design that combines GPUs, SambaNova RDUs, and Intel Xeon 6 CPUs to address the performance bottlenecks emerging in agentic AI workloads. The...
Intel Foundry presented a 300 mm gallium nitride (GaN)-on-silicon chiplet platform at the IEEE International Electron Devices Meeting (IEDM) 2025, highlighting an ultra-thin GaN chiplet with a 19 micrometer silicon base and...
Applied Materials introduces new deposition systems targeting angstrom-era logic nodes, as chipmakers transition to Gate-All-Around (GAA) transistor architectures at 2nm and beyond. The company unveiled its Precision™ Selective Nitride PECVD...
Intel confirmed its participation in the emerging “Terafab” initiative alongside SpaceX, xAI, and Tesla, signaling early alignment between leading compute, AI, and manufacturing players around next-generation silicon production. The confirmation came via a statement...
Broadcom and Google have signed long-term agreements covering custom AI processors and rack-level infrastructure, extending their collaboration on hyperscale AI systems through 2031. The deals formalize Broadcom’s role in both...
Intel will repurchase the remaining 49% stake in its Fab 34 joint venture in Ireland from Apollo Global Management for $14.2 billion, restoring full ownership of one of its most advanced European manufacturing...
Cognichip secured $60 million in Series A funding to scale its physics-informed AI platform for chip design, bringing total funding to $93 million. The round was led by Seligman Ventures with participation...
NVIDIA and Marvell Technology announced a strategic partnership to integrate Marvell’s custom silicon and networking capabilities into NVIDIA’s NVLink Fusion ecosystem, extending the reach of NVIDIA’s AI factory architecture. The collaboration also includes...
Camtek Ltd. secured a $31 million multi-system order from a leading OSAT, with systems targeted primarily at CoWoS-like advanced packaging flows supporting AI processors. The company reported that total orders from...
TeraSignal unveiled its TS5802 intelligent redriver at OFC 2026, targeting performance bottlenecks in 200G+ electrical interconnects used in AI scale-up networks. The CMOS-based device integrates advanced analog equalization with CMIS-compliant...
Mojo Vision, a start-up based in Cupertino, California, announced a $17.5 million strategic investment from Future Ventures to accelerate commercialization of its micro-LED platform for next-generation optical I/O in AI...
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