Semiconductors

Lattice Semiconductor reported Q1 2026 revenue of $170.9 million, up 42.2% year-over-year, driven by strong demand across compute, communications, industrial, and embedded markets. The company posted GAAP gross margin of...

Broadcom introduced a new set of broadband silicon platforms that combine optimized 10G PON with Wi-Fi 8 to address cost-sensitive, high-volume residential deployments. The announcement centers on a new PON...

Cadence Design Systems reported first-quarter 2026 revenue of $1.474 billion, up from $1.242 billion a year earlier, as demand for AI-driven semiconductor and system design tools continued to expand across...

Tower Semiconductor and Axiro Semiconductor introduced a new line of radar beamforming ICs built on silicon germanium (SiGe) technology and fabricated in U.S. facilities, targeting next-generation defense and satellite communications systems. The...

Kyocera Corporation introduced a new multilayer ceramic core substrate targeting advanced semiconductor packaging for AI processors and switch ASICs, addressing scaling challenges in next-generation data center architectures. The company will...

The Rise of CPU Power in Agentic AI Meta will expand its AI infrastructure footprint with a large-scale deployment of Amazon Web Services (AWS) Graviton5 processors, targeting the growing class of agentic...

Atomera expanded its collaboration with Synopsys to accelerate modeling of gallium nitride (GaN) devices targeting high-growth RF and power semiconductor markets. The effort integrates Atomera’s Mears Silicon Technology (MST®) with Synopsys’ Sentaurus™...

Synopsys expanded its collaboration with TSMC across advanced-node EDA flows, silicon-proven IP, 3D multi-die design, and co-packaged optics enablement for next-generation AI and high-performance computing systems. The work spans TSMC’s...

Google detailed a major expansion of its AI infrastructure stack with the introduction of eighth-generation Tensor Processing Units (TPUs) and a redesigned system architecture aimed at supporting planet-scale training and inference workloads, including...

Point2 Technology, a Silicon Valley startup developing RF-based interconnect solutions for AI infrastructure, secured an extension to its Series B funding round led by Maverick Silicon, with participation from NVentures...

Syenta, an Australia-founded semiconductor startup focused on advanced packaging, raised $26 million in Series A funding to commercialize its chip-to-chip interconnect technology for AI systems. The round was led by...

SambaNova Systems has signed a distribution and deployment agreement with TEPCO Systems Corporation to deliver energy-efficient AI infrastructure across Japan. The deal positions TEPCO Systems as both a reseller and operator, using...

Cerebras Systems filed an S-1 registration with the Securities and Exchange Commission (SEC), offering a detailed look at one of the most ambitious alternative architectures in AI infrastructure. The IPO...