TeraSignal introduced its TS5802 intelligent redriver at OFC 2026, targeting next-generation 200G+ copper interconnects used in AI scale-up networks. The CMOS-based device integrates advanced analog equalization with CMIS-based link training...
NVIDIA used its GTC conference to outline a strategy for bringing accelerated computing into space-based infrastructure, introducing platforms designed to deliver data-center-class AI performance in size-, weight- and power-constrained environments....
Broadcom announced that its Tomahawk 6 switch silicon is now shipping in production volume, marking the commercial availability of the industry’s first 102.4 Tbps Ethernet switch designed for AI infrastructure....
Austin-based La Luce Cristallina announced the beta availability of a 200-mm (8-inch) barium titanate (BaTiO₃) wafer platform designed for next-generation electro-optic modulators used in telecommunications and data communications systems. The...
Meta published new technical details on its Meta Training and Inference Accelerator (MTIA) program, outlining a rapid multi-generation roadmap for custom AI processors designed to power machine learning workloads across...
Applied Materials and Micron Technology announced a joint effort to develop next-generation memory technologies for artificial intelligence systems, combining research capabilities at Applied’s new EPIC Center in Silicon Valley and...
Amber Semiconductor, a start-up based in Dublin, California, announced a $30 million Series C funding round to accelerate commercialization of its vertical power delivery technology designed for next-generation AI servers...
Eridu, a Saratoga, California–based startup focused on next-generation AI networking infrastructure, emerged from stealth with more than $200 million in funding to develop a new class of high-performance switching architecture...
Wolfspeed positions 300mm silicon carbide as a materials platform for next-generation AI and HPC packaging Wolfspeed outlined a new roadmap for using 300mm silicon carbide (SiC) substrates as a foundational...
Marvell introduced a new generation of coherent optical technology designed to scale interconnect capacity between AI data centers. The company unveiled what it describes as the industry’s first 1.6T ZR/ZR+...
Broadcom Reports Record $19.3B Revenue in Q1 FY2026 Broadcom reported record first-quarter fiscal 2026 revenue of $19.3 billion, driven by accelerating demand for AI-related semiconductor solutions. The company said revenue...
Ayar Labs secured $500 million in Series E funding to accelerate high-volume production of its co-packaged optics (CPO) technology aimed at AI scale-up infrastructure. The round was led by Neuberger...
Axelera AI raised a new funding round led by Innovation Industries, adding BlackRock and SiteGround Capital as new investors and bringing total capital raised to more than $450 million since...
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