Silicon for AI, Cloud, Telecom and Digital Infrastructure Converge Digest tracks the semiconductor platforms powering next-generation networks, AI clusters, optical systems, data centers, wireless infrastructure and edge devices. |
Silicon Pillars AI AcceleratorsNetworking SiliconOptical DSPsChipletsMemorySilicon PhotonicsWireless SoCs |
| Tracking: Tapeouts • Process Nodes • Packaging • Foundry Partnerships • AI Inference • Ethernet Switching • Coherent Optics • Memory Bandwidth • Power Efficiency • Supply Chain |
Broadcom introduces NetGNT, a neural-network inference engine, in its new Trident 5-X12 chip for data center switches. The chip offers enhanced performance and supports 800G ports, enabling direct connection to...
Broadcom introduces NetGNT, an on-chip neural-network inference engine in its Trident 5-X12 chip for data center switches. The chip offers increased bandwidth and supports 800G ports, enabling better network performance....
Credo announced sampling of its Dove 850 800G Digital Signal Processor (DSP) IC, optimized for Linear Receive Optics (LRO), also known within the industry as Half-retimed Linear Optics (HALO). A...
Hewlett Packard Enterprise announced an expanded alliance with NVIDIA to build an enterprise computing solution for generative AI (GenAI). These solutions integrate HPE Machine Learning Development Environment Software, HPE Ezmeral...
Marvell Technology has joined the Ultra Ethernet Consortium (UEC), part of the Linux Foundation's Joint Development Foundation. "The future of the AI cloud will rely on standards-based Ethernet to deliver...
The Chips for America program is investing $3 billion in the National Advanced Packaging Manufacturing Program to boost semiconductor leadership in the US. This initiative focuses on advanced packaging technology,...
Infinera has been awarded a $14 million CalCompetes grant to expand and modernize their US-based semiconductor production, supporting innovation and economic development.
Dell Technologies, Hewlett Packard Enterprise, and Lenovo are set to integrate NVIDIA Spectrum-X Ethernet networking technologies into their server lineups. This new class of Ethernet networking offers 1.6x higher networking...
MediaTek completes 5G NR and RedCap interoperability testing using Keysight's solutions, validating Rel-17 features and driving market advancements in 5G technology.
MediaTek introduces the T300 series, the world's first 6nm RFSOC designed for RedCap applications, offering cost-effective and energy-efficient solutions for IoT devices.
MediaTek introduces Filogic 860 and Filogic 360 chipsets, supporting Wi-Fi7. Filogic 860 is ideal for enterprise access points, service providers, retail, and IoT routers. Filogic 360 delivers next-gen Wi-Fi 7...
A newly introduced Synopsys.ai Copilot, the result of a strategic collaboration with Microsoft to integrate Azure OpenAI Service, aims to accelerate the design process for semiconductors. Azure OpenAI Service gives...
Kulicke and Soffa Industries confirms multiple orders for its Thermocompression Bonding solutions, supporting Silicon Photonics-based Co-Packaged Optics applications. Anticipates more orders for aggressive capacity expansion in 2024-2025.
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