Comcast and Broadcom are designing and building the new chipset based upon CableLabs’ DOCSIS 4.0 specifications and aimed at enabling the first AI-powered access network. The new chipset that embeds AI...
Positron Access Solutions has selected the MaxLinear G.hn chipset for use in its G.hn Access Multiplexers (GAM) products. The Positron GAM solutions can deliver gigabit-class services to legacy properties over...
Mitsubishi Electric will invest US$500 million (approx. 75 billion yen) in Coherent Corp.'s new silicon carbide (SiC) spin-off.Mitsubishi Electric said it is aiming to expand its SiC power device business...
Intel will separate its Programmable Solutions Group (PSG) operations into a standalone business effective 01-January-2024. The independent business will be headed by Sandra Rivera, who currently heads Intel’s Data Center...
Broadcom announced shipping of its 5nm 200G/lane optical PAM-4 DSP PHY featuring 200G/lane serial optical interfaces, which enable 800G and 1.6T pluggable optical transceiver modules. The new Sian BCM85822 is...
ntel announced Thunderbolt 5, promising 80 Gbps of bi-directional bandwidth, and with Bandwidth Boost up to 120 Gbps for displays. Thunderbolt 5, will provide up to three times more bandwidth...
The U.S. Department of Defense awarded $238 million or the establishment of eight Microelectronics Commons (Commons) regional innovation hubs. The Microelectronics Commons, a key component of the CHIPS and Science...
Intel demonstrated the first multi-chiplet package using Universal Chiplet Interconnect Express (UCIe) interconnects. Universal Chiplet Interconnect Express (UCIe) is an open industry standard for a die-to-die interconnect and serial bus...
indie Semiconductor has acquired privately held EXALOS AG, a Swiss photonics company, specializing in the design of high-performance optical semiconductors. indie paid approximately $45 million to EXALOS equity holders comprised...
SiTime introduced a MEMS-based, oven-controlled oscillator (OCXO) that delivers an ultra-stable clock to datacenter and network infrastructure equipment In order to maintain optimal network performance and reliability, precision timing plays...
AMD announced the availability of its EPYC 8004 Series processors featuring the "Zen 4c" core, which is optimized for energy efficiency and performance in space-constrained environments from the intelligent edge...
Intel expanded its Agilex FPGA portfolio and broadened its Programmable Solutions Group (PSG) offerings to handle the increased demand for customized workloads, including enhanced AI capabilities, and to provide lower...
Intel announced glass substrates for next-generation advanced packaging The new material offers ultra-low flatness and better thermal and mechanical stability, resulting in much higher interconnect density in a substrate. Compared...
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