Semiconductors

Silicon solutions for data centers, network infrastructure, and CPE

Lightmatter and Cadence Collaborate on CPO 

Lightmatter announced a technical collaboration with Cadence to develop co-packaged optics (CPO) solutions that combine Cadence’s silicon-proven high-speed SerDes and UCIe IP with Lightmatter’s Passage optical engine. The effort targets hyperscale AI and...

Micron to Acquire Fab in Taiwan for $1.8B

Micron Technology signed an exclusive letter of intent to acquire Powerchip Semiconductor Manufacturing Corporation’s P5 fabrication site in Tongluo, Miaoli County, Taiwan, for US$1.8 billion in cash. The deal adds roughly 300,000...

Cadence Launches Chiplet Partner Ecosystem

Cadence unveiled a new Chiplet Spec-to-Packaged Parts ecosystem aimed at reducing engineering complexity and accelerating time to market for customers building chiplets for physical AI, data center, and high-performance computing (HPC)...

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