Silicon for AI, Cloud, Telecom and Digital Infrastructure Converge Digest tracks the semiconductor platforms powering next-generation networks, AI clusters, optical systems, data centers, wireless infrastructure and edge devices. |
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| Tracking: Tapeouts • Process Nodes • Packaging • Foundry Partnerships • AI Inference • Ethernet Switching • Coherent Optics • Memory Bandwidth • Power Efficiency • Supply Chain |
Intel will repurchase the remaining 49% stake in its Fab 34 joint venture in Ireland from Apollo Global Management for $14.2 billion, restoring full ownership of one of its most advanced European manufacturing...
Cognichip secured $60 million in Series A funding to scale its physics-informed AI platform for chip design, bringing total funding to $93 million. The round was led by Seligman Ventures with participation...
NVIDIA and Marvell Technology announced a strategic partnership to integrate Marvell’s custom silicon and networking capabilities into NVIDIA’s NVLink Fusion ecosystem, extending the reach of NVIDIA’s AI factory architecture. The collaboration also includes...
Camtek Ltd. secured a $31 million multi-system order from a leading OSAT, with systems targeted primarily at CoWoS-like advanced packaging flows supporting AI processors. The company reported that total orders from...
TeraSignal unveiled its TS5802 intelligent redriver at OFC 2026, targeting performance bottlenecks in 200G+ electrical interconnects used in AI scale-up networks. The CMOS-based device integrates advanced analog equalization with CMIS-compliant...
Mojo Vision, a start-up based in Cupertino, California, announced a $17.5 million strategic investment from Future Ventures to accelerate commercialization of its micro-LED platform for next-generation optical I/O in AI...
Tower Semiconductor outlined a major restructuring of its Japan operations, taking full ownership of its 300mm fabrication facility (Fab 7) in Uozu while transferring the 200mm fab (Fab 5) to...
Arm is moving into production silicon for the first time, introducing its own data center processor designed specifically for the emerging class of agentic AI workloads. The new Arm AGI...
TeraSignal introduced its TS5802 intelligent redriver at OFC 2026, targeting next-generation 200G+ copper interconnects used in AI scale-up networks. The CMOS-based device integrates advanced analog equalization with CMIS-based link training...
NVIDIA used its GTC conference to outline a strategy for bringing accelerated computing into space-based infrastructure, introducing platforms designed to deliver data-center-class AI performance in size-, weight- and power-constrained environments....
Broadcom announced that its Tomahawk 6 switch silicon is now shipping in production volume, marking the commercial availability of the industry’s first 102.4 Tbps Ethernet switch designed for AI infrastructure....
Austin-based La Luce Cristallina announced the beta availability of a 200-mm (8-inch) barium titanate (BaTiO₃) wafer platform designed for next-generation electro-optic modulators used in telecommunications and data communications systems. The...
Meta published new technical details on its Meta Training and Inference Accelerator (MTIA) program, outlining a rapid multi-generation roadmap for custom AI processors designed to power machine learning workloads across...
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