Credo Technology Group Holding Ltd reported preliminary third quarter fiscal year 2026 revenue well above prior expectations, driven by accelerating demand for high-speed connectivity in AI and data-center infrastructure. The company...
Positron AI raised $230 million in an oversubscribed Series B financing at a post-money valuation exceeding $1 billion, as investors continue to back alternative architectures for AI inference. The round was...
Texas Instruments agreed to acquire Silicon Labs in an all-cash transaction valued at approximately $7.5 billion, strengthening its position in embedded wireless connectivity. The deal, announced February 4, 2026, values...
Siemens has acquired Canopus AI to expand its electronic design automation (EDA) software portfolio with AI-driven computational metrology and inspection. The deal, which closed on January 12, 2026, strengthens Siemens’ semiconductor manufacturing digital...
Advanced Micro Devices reported record fourth-quarter and full-year 2025 financial results on February 3, underscoring continued momentum across its data center, client, and AI businesses. Fourth-quarter revenue reached $10.3 billion, up...
Broadcom introduced the industry’s first enterprise Wi-Fi 8 access point and switching solution built on a unified silicon architecture, extending its Wi-Fi 8 roadmap first previewed in October 2025. The platform...
Intel Corp. announced a collaboration with SAIMEMORY, a subsidiary of SoftBank Corp., to develop a new stacked memory technology known as Z-Angle Memory (ZAM). The initiative targets next-generation memory architectures...
Tokyo-based THine Electronics announced a DSP-free optical chipset built around its ZERO EYE SKEW technology, targeting short-reach optical interconnects for PCI Express 6 and 7 in linear pluggable optics (LPO)...
Micron Technology broke ground on a new advanced wafer fabrication facility in Singapore, committing approximately $24 billion over the next decade to expand NAND manufacturing capacity. The facility, located within...
Credo introduced the Blue Heron 224G AI scale-up retimer, positioning it as the industry’s first multiprotocol 224G retimer designed to support UALink, Ethernet for Scale-Up Networking (ESUN), and Ethernet. The...
Lightmatter and Synopsys announced a collaboration to integrate Synopsys’ 224G SerDes and UCIe IP, qualified for a 3nm process, into Lightmatter’s Passage 3D co-packaged optics (CPO) platform. The companies are targeting hyperscale AI...
Lightmatter announced a technical collaboration with Cadence to develop co-packaged optics (CPO) solutions that combine Cadence’s silicon-proven high-speed SerDes and UCIe IP with Lightmatter’s Passage optical engine. The effort targets hyperscale AI and...
Lightmatter and Global Unichip Corp. (GUC) announced a strategic partnership to bring commercial Passage 3D co-packaged optics (CPO) solutions to market for hyperscale AI and high-performance computing environments. The collaboration combines Lightmatter’s silicon...
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