• Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Friday, June 5, 2026
  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » Chiplet Architecture for Next Gen Infrastructure

Chiplet Architecture for Next Gen Infrastructure

December 18, 2023
in Video
A A

What’s driving the deep interest in chiplet architecture? How does it scale, and is there a role for open interfaces?

Bapi Vinnakota, ODSA Project Lead from Open Compute Project explains:

  • Chiplets are currently the fastest and most efficient way to build heterogenous systems, integrating different types of compute into one package. This is essential for accommodating the ever-changing AI workloads.
  • The IO bandwidth, both into memory and in terms of raw network, needs to increase dramatically to keep up with the growing demands of data centers. Companies associated with the ODSA are working on solutions to this challenge.
  • Open interfaces are believed to be the best way to integrate systems, creating composable systems that integrate chiplet devices from multiple vendors into one usable whole. This is a fundamental belief at the OCP and is key to meeting the requirements of future data centers, especially those with AI-intensive workloads.

Want to be involved our video series? Contact [email protected]

Tags: OCP
ShareTweetShareSummarizeSummarize
Previous Post

Deutsche Telekom expands fiber reach

Next Post

Democratizing Networking with SONiC

Jim Carroll

Jim Carroll

Editor and Publisher, Converge! Network Digest, Optical Networks Daily - Covering the full stack of network convergence from Silicon Valley

Related Posts

Data Centers

Multipath Reliable Connection (MRC) Redesigns Ethernet for GPU AI Clusters

May 6, 2026
AI Infrastructure

OCP Releases ESUN 1.0 Spec for Ethernet-Based Scale-Up AI Fabrics

March 10, 2026
Data Centers

OCP Power Distribution Project Tackles Safety Gaps in High-Voltage AI Facilities

January 26, 2026
Data Centers

OCP Names Zane Ball CTO, Russ Wunderlich Principal Hardware Engineer

August 13, 2025
Semiconductors

OCP Unveils Universal Link Layer Spec to Boost Chiplet Interoperability

August 5, 2025
Optical

OCP Launches Optical Circuit Switching Subproject

July 21, 2025
Next Post

3 Broad Trends in Edge Computing

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io

© 2026 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io

© 2026 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version