Alphawave Semi will demonstrate its latest AI and connectivity IP innovations at the European Conference on Optical Communication (ECOC) 2024 in Frankfurt. At booth B115, the company will showcase a series of cutting-edge solutions aimed at accelerating AI, HPC, and cloud infrastructures, with collaborations across key industry partners.
Key demonstrations include:
• First live demo of 24Gbps UCIe D2D subsystem in TSMC’s 3nm CoWoS Advanced Packaging.
• 128 GT/s Optical PCIe demo with Innolight LPO.
• 128 GT/s Electrical PCIe demo with Samtec High-Density Interconnect for GPU-GPU connections, viewable at Samtec’s stand (#D2).
• Energy-efficient accelerator card featuring I/O chiplet, compute chiplet, UCIe, and HBM subsystems, in collaboration with Lessengers and TE Future Connectivity.
• OIF demos showcasing interoperability of 112G SerDes and PCIe 7.0 inter-optical loopbacks, supported by TE and Lessenger, at the OIF stand (#B83).
Additionally, Alphawave Semi CTO, Dr. Tony Chan Carusone, will lead a workshop on September 22 addressing I/O solutions for AI clusters. The session will discuss challenges related to AI scalability, multi-chip packaging, thermal management, and optical I/O solutions.
“These demonstrations underscore our commitment to driving advancements in connectivity IP for AI, cloud, and high-performance computing applications,” said Dr. Carusone.
