Singapore-based Kulicke and Soffa Industries, which is known for designing, manufacturing, and servicing equipment used in the assembly of semiconductor devices, confirmed the release of multiple orders for its Thermocompression Bonding (TCB) solutions, primarily supporting Silicon Photonics (SiPh) based Co-Packaged Optics (CPO) applications deployed in high-bandwidth networking transceivers. K&S anticipates a series of follow on CPO orders to support aggressive capacity expansion plans throughout fiscal years 2024 and 2025.
“Our capable, performance-focused advanced packaging solutions are driving significant market interest, as they efficiently address many emerging assembly challenges. Our unique solutions provide precision control and critical features, which unlock meaningful value for the most challenging optical, high-volume logic and emerging heterogeneous applications. These recent orders highlight our leadership in TCB, but also validate the growth potential of the emerging advanced packaging marketplace,” said John Molnar, K&S Vice President & General Manager, Advanced Solutions.