Molex introduced a multi-channel liquid-cooled busbar capability at Computex 2026, targeting the rapidly growing power density requirements of AI data centers. The company said the technology combines electrical power distribution and liquid cooling into a unified infrastructure component designed to support next-generation AI systems.
As AI racks move toward hundreds of kilowatts and eventually megawatt-scale configurations, traditional approaches to power distribution and thermal management are becoming increasingly difficult to scale. Molex’s design integrates liquid cooling directly into busbar structures, allowing operators to manage both electrical and thermal loads through a common platform while improving overall system efficiency.
The announcement reflects a broader trend across the AI infrastructure ecosystem toward integrated approaches that combine power delivery, cooling, and rack-level design. Suppliers throughout the industry are exploring new architectures to support increasingly dense compute deployments driven by accelerated computing and large-scale AI training systems.
“AI infrastructure requires a new generation of power and thermal management technologies,” the company said.
