Intel is advancing silicon photonics technology to support next-generation 1.6 Tbps pluggable optical transceivers, targeting the high-bandwidth, low-latency demands of AI infrastructure. The company’s co-packaged optics and pluggable modules are designed to reduce power consumption and heat at the switch and server level, enabling more scalable data center architectures.
Christian Urricariet, Senior Director of Product Marketing, Integrated Photonics Solutions from Intel explains:
– Showcasing 1.6 Tbps transmitter photonic integrated circuit (PIC) with integrated laser, demonstrating interoperability with ecosystem components
– Ramping up second-generation photonic manufacturing in US-based New Mexico fab to support both pluggable transceivers and co-packaged optics
– Building on 20+ years of silicon photonics leadership with over 8 million transceivers and 32 million integrated lasers shipped since 2016
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