SiFive secured $400 million in an oversubscribed Series G funding round to accelerate development of high-performance RISC-V CPU and AI IP ...

Altera announced plans to extend lifecycle support for its Agilex, MAX 10, and Cyclone V FPGA families through 2045, targeting customers ...

Coherent Corp. introduced new silicon carbide (SiC) thick epitaxy capabilities designed to support power devices operating up to 10kV, targeting next-generation ...

NTT DATA announced the opening of its Keihanna OSK11 Data Center in Kyoto, expanding its digital infrastructure footprint in Japan’s Kansai ...

SambaNova Systems and Intel unveiled a production-scale heterogeneous AI infrastructure design that combines GPUs, SambaNova RDUs, and Intel Xeon 6 CPUs to ...

Intel Foundry presented a 300 mm gallium nitride (GaN)-on-silicon chiplet platform at the IEEE International Electron Devices Meeting (IEDM) 2025, highlighting an ...

Applied Materials introduces new deposition systems targeting angstrom-era logic nodes, as chipmakers transition to Gate-All-Around (GAA) transistor architectures at 2nm ...

Adtran introduced Ensemble Cloudlet multi-node, a high-availability edge platform aimed at AI inference and agentic AI workloads that require low ...

US Mobile is preparing to bundle Starlink residential broadband with its multi-network wireless offering, shifting the narrative from direct-to-device satellite mobility to a ...

Digital Realty launched its NRT14 data center in Inzai City, Japan, marking the third facility at its Narita (NRT) campus ...

Nutanix used its .NEXT conference to broaden the Nutanix Cloud Platform (NCP) with new capabilities aimed at enterprise AI, hybrid ...

Vector Photonics demonstrated a free-space optical communications link using photonic crystal surface emitting lasers (PCSELs) across the River Clyde in ...

Broadcom launched Arcot Smart Ruleset, an AI-driven 3-D Secure engine aimed at helping card issuers improve fraud detection while cutting ...