TeraSignal introduced its TS5802 intelligent redriver at OFC 2026, targeting next-generation 200G+ copper interconnects used in AI scale-up networks. The ...

Semtech said it is showcasing live demonstrations at OFC 2026 spanning 224G and 448G solutions for AI and data center ...

LightSpeed Photonics is unveiling a new near-packaged optical interconnect architecture designed to simplify the integration of optical connectivity within AI ...

Marvell: AI Infrastructure Bottlenecks Shift from Compute to Connectivity At the Optica Executive Forum, Dave Lazovsky, EVP and GM of ...

Broadcom Outlines Optical Scale-Up Strategy for AI Fabrics, Backs New OCI MSA At the Optica Executive Forum in Los Angeles ...

Lightmatter introduced its Passage L20 optical engine, targeting high-density optical interconnects for AI data centers as bandwidth requirements push beyond ...

Nokia introduced a PON-based out-of-band management (OOBM) architecture aimed at simplifying data center operations while reducing power, space, and cost. ...

A new Multi-Source Agreement (MSA) focused on multicore fiber (MCF) has emerged as hyperscale operators push toward higher fiber density ...

NVIDIA introduced its Vera Rubin DSX AI Factory reference design and made its Omniverse DSX Blueprint generally available, positioning both ...

Marvell and Lumentum demonstrated a rack-scale optical circuit switching (OCS) system designed to improve scalability and efficiency in AI cluster ...

VIAVI Solutions introduced a new validation platform designed to support 224G SerDes and 1.6T optical systems, addressing the growing complexity ...

Keysight and Broadcom demonstrated interoperability of Ultra Ethernet Consortium technologies at full 800 GbE line rate, showcasing link-layer mechanisms designed ...

AFL, Corning Incorporated, Lightera, and Prysmian issued a joint statement on March 16, 2026 affirming their ability to supply Build ...