Amkor Technology and TSMC agreed to collaborate on advanced semiconductor packaging and testing capabilities in Arizona. The agreement involves Amkor providing turnkey advanced packaging and test services at its planned facility in Peoria, while TSMC will leverage these services to support its customers utilizing its advanced wafer fabrication plant in Phoenix. This collaboration is expected to significantly reduce product cycle times by aligning front-end and back-end semiconductor manufacturing within the region, enhancing the overall semiconductor ecosystem in the United States.
The companies will jointly focus on packaging technologies like TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS®) to meet customer needs in high-performance computing and communications. The partnership aims to foster geographic flexibility and strengthen the U.S. semiconductor supply chain. Both companies emphasize the importance of a seamless integration between wafer fabrication and packaging processes, ensuring innovation and resilient supply chains for their customers.Key Points:
