Intel is advancing silicon photonics technology to support next-generation 1.6 Tbps pluggable optical transceivers, targeting the high-bandwidth, low-latency demands of AI infrastructure. The company’s co-packaged optics and pluggable modules are...
PacketLight Networks introduced the PL-8000M, a 2 x 800G muxponder platform designed for high-capacity transport in AI, cloud, and enterprise network environments. The device will be demonstrated live at OFC 2025, booth...
Telescent is showcasing a live demonstration of its new G5 optical patch panel with MPO-16 connectors at OFC 2025 in San Francisco. The system is capable of switching up to...
Ayar Labs introduced the industry’s first Universal Chiplet Interconnect Express (UCIe) optical interconnect chiplet, the TeraPHY, aimed at enhancing AI infrastructure by delivering up to 8 Tbps bandwidth. Powered by...
Credo Technology announced the Lark family of ultra-low power optical DSPs, targeting 800G transceivers in AI-driven data centers and hyperscale cloud networks. Introduced at OFC 2025, the new Lark 800...
iPronics,a start-up based in Spain, unveiled an Optical Circuit Switch (OCS) built entirely on a silicon photonics platform. The iPronics ONE-32 enables ultra-low latency, dynamic Layer 1 networking, and significant...
Mixx Technologies, a start-up based in San Jose, California, announced its Advanced 3DS Platform, a next-generation optical interconnect architecture designed to address bandwidth bottlenecks in AI and high-performance computing (HPC)...
Jabil has unveiled a new line of 1.6 Terabit per second (Tbps) transceivers to meet the growing bandwidth demands of artificial intelligence (AI), machine learning (ML), high-performance computing (HPC), and cloud data...
Luxshare-Tech unveiled a portfolio of optical and copper interconnect solutions at OFC 2025, including 1.6T and 800G transceivers, advanced DACs, and PCIe Gen7-ready interconnects aimed at enabling scalable, low-latency, and...
At OFC 2025, Broadcom showcased its powerful portfolio of optical and electrical interconnect solutions for AI infrastructure. The company highlighted advances across co-packaged optics (CPO), 200G/lane DSP and SerDes technologies,...
At OFC 2025, Lightmatter introduced two groundbreaking products—Passage™ M1000 and Passage™ L200/L200X—that redefine the future of AI infrastructure by delivering record-breaking bandwidth and eliminating interconnect bottlenecks. These next-generation 3D photonic superchips and co-packaged optics...
At OFC 2025, Keysight Technologies, NTT Innovative Devices, and Lumentum demonstrated a groundbreaking 448 Gbps per-lane optical transmission using 224 GBaud PAM4 technology, setting the stage for future 3.2T optical...
At OFC 2025, Lightera unveiled a comprehensive lineup of optical fiber technologies designed to meet the escalating demands of hyperscale data centers, AI/ML workloads, and high-density interconnects. Demonstrations across Booths...
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