Credo Technology Group has completed its acquisition of DustPhotonics, formally bringing silicon photonics photonic integrated circuit (PIC) technology into its expanding portfolio for AI infrastructure connectivity. The transaction closes a deal first announced earlier this year and extends Credo’s reach deeper into optical interconnects for high-bandwidth AI clusters. Converge Digest previously covered the planned acquisition when Credo outlined its strategy to broaden its footprint beyond DSPs and active electrical cables into integrated optical technologies.
DustPhotonics contributes silicon photonics PIC technology targeted at next-generation optical connectivity, including 800G, 1.6T, and emerging 3.2T near-packaged optics (NPO) and co-packaged optics (CPO). With the acquisition complete, Credo now spans a broader vertical stack that includes SerDes, DSP, silicon photonics, and system-level integration for both scale-out Ethernet fabrics and scale-up AI interconnect architectures. The company said the combined platform addresses both electrical and optical interconnect requirements across AI infrastructure buildouts, where bandwidth density, power efficiency, and system integration continue to drive architectural decisions.
Credo said the addition of DustPhotonics is expected to contribute meaningfully to growth in fiscal 2027, alongside its portfolio of ZeroFlap optical transceivers, optical DSPs, and connectivity products already shipping into hyperscale deployments. Bill Brennan, President and CEO of Credo, said the combined organizations will continue building “a powerful, end-to-end optical connectivity solution platform with reliability and power efficiency at its core.” Ronnen Lovinger, now Vice President of Silicon Photonics at Credo, added that silicon photonics is increasingly becoming foundational for AI-driven optical connectivity as network infrastructure scales toward higher bandwidth and lower power-per-bit requirements.
- Acquisition completed on May 28, 2026
- Adds silicon photonics PIC technology from DustPhotonics into Credo’s portfolio
- Supports 800G, 1.6T, and future 3.2T optical interconnects
- Expands Credo’s capabilities across near-packaged optics (NPO) and co-packaged optics (CPO)
- Combined portfolio now spans:
- SerDes
- optical DSPs
- silicon photonics
- ZeroFlap optical transceivers
- system-level optical integration
- Credo expects optical products to be a significant growth driver in fiscal 2027
“Silicon photonics will increasingly become the foundational technology for AI-driven optical connectivity—enabling the bandwidth, efficiency, and scale that next-generation infrastructure demands,” said Ronnen Lovinger, Vice President, Silicon Photonics at Credo.
🌐 Analysis: Credo’s closing of the DustPhotonics acquisition strengthens its positioning in one of the fastest-moving segments of AI infrastructure: optical interconnect. As hyperscale AI deployments push beyond 800G toward 1.6T and roadmap discussions begin around 3.2T, vendors are increasingly seeking tighter integration between DSPs, lasers, photonics, packaging, and system design. The deal gives Credo more direct control over that stack.
🌐 DustPhotonics, a startup founded in 2017 and headquartered in Israel, was headed by CEO Ronnen Lovinger (with prior operating roles at Mellanox and Innoviz),while co-founder and Chief R&D Officer Yoel Chetrit added technical leadership in photonics. The company was chaired by prominent Israeli semiconductor entrepreneur Avigdor Willenz, known for his successes with Galileo Technology, Annapurna Labs, and Habana Labs.
At its core, DustPhotonics developed a comprehensive silicon photonics platform centered on photonic integrated circuits (PICs) and advanced laser-integration techniques, notably its proprietary low-loss laser coupling (L3C) approach. This enables higher bandwidth, lower power consumption, reduced cost, and scalable manufacturability for optical engines used across pluggable, near-package optics (NPO), and co-packaged optics (CPO) in AI and hyperscale data-center interconnects.
The Dust product portfolio, prior to acquisition, included:
Tamar200 — 1.6T-2xFR4 Silicon Photonics Chip (industry’s first merchant 1.6T-2xFR4 PIC)
Carmel4 — 400G DR4 Silicon Photonics Engine
Carmel8 — 800G DR8 Silicon Photonics Engine
Oz4 — 800G DR4 Silicon Photonics Engine
Oz8 — 1.6T DR8 Silicon Photonics Engine
Tamar — 800G-2xFR4 Silicon Photonics Chip with integrated multiplexer
