HyperLight has launched its TFLN Chiplet platform, a modular and scalable photonics ecosystem built on the company’s high-volume 6-inch thin-film lithium niobate (TFLN) production line. The platform is also forward-compatible with an 8-inch pilot line, aimed at meeting the integration and packaging needs of future applications. Located in Cambridge, Massachusetts, HyperLight positions the Chiplet platform as a foundation for next-generation optical systems in AI, telecommunications, quantum computing, and other data-intensive sectors.
The TFLN Chiplet platform supports wafer-scale fabrication, testing, and integration, offering a streamlined path from design to production for high-performance optical components. HyperLight’s platform targets several demanding use cases, including low-power, high-bandwidth components for AI and datacom, Telcordia-qualified systems for telecom, and ultra-low loss modules for quantum applications. With over 70 granted and pending patents, HyperLight provides IP assurance and a stable platform for long-term product development.
The company emphasizes industrial readiness, citing a decade of R&D and ecosystem collaboration that has resulted in a mature manufacturing process. The 6-inch production line forms the commercial backbone of HyperLight’s offerings, while the 8-inch pilot line is intended to align with emerging industry standards. The modular nature of the Chiplet platform allows for customized solutions tailored to specific application domains, accelerating development and deployment timelines for customers.
Key Points:
• HyperLight launches TFLN Chiplet platform on a qualified 6-inch TFLN manufacturing line, with an 8-inch pilot line added for future scaling.
• Platform targets AI/datacom, telecom, quantum computing, and precision test and measurement applications.
• Supports wafer-scale fabrication, integration, and testing with modular building blocks.
• Over 70 pending/granted patents support platform IP and long-term product viability.
• Delivers low-loss, high-bandwidth, and Telcordia-qualified components across multiple industries.
“The TFLN Chiplet™ platform is built for today’s industrial scale, evolves with the market, and is designed to align with our partners’ and the ecosystem’s long-term success,” said Mian Zhang, CEO of HyperLight.
