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Home » Intel’s Next Xeon Phi Brings Omni-Path Fabric and 10nm process

Intel’s Next Xeon Phi Brings Omni-Path Fabric and 10nm process

November 18, 2014
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Intel’s third-generation Intel Xeon Phi product family, code-named Knights Hill, will be built using Intel’s 10nm process technology and integrate Intel Omni-Path Fabric technology. Knights Hill will follow the upcoming Knights Landing product, with first commercial systems based on Knights Landing expected to begin shipping next year.

Intel also disclosed that its Intel Omni-Path Architecture will achieve 100 Gbps line speed and up to 56 percent lower switch fabric latency in medium-to-large clusters than InfiniBand alternatives. The architecture targets a 48 port switch chip compared to the current 36 port InfiniBand alternatives. This will reduce the number of switches required in HPC clusters.

“Intel is excited about the strong market momentum and customer investment in the development of HPC systems based on current and future Intel Xeon Phi processors and high-speed fabric technology,” said Charles Wuischpard, vice president, Data Center Group, and general manager of Workstations and HPC at Intel. “The integration of these fundamental HPC building blocks, combined with an open standards-based programming model, will maximize HPC system performance, broaden accessibility and use, and serve as the on-ramp to exascale.”

http://www.intel.com/xeonphi

http://www.intel.com/omnipath

Tags: #SC14Blueprint columnsHPCIntelSilicon
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