M/A-COM Technology Solutions is demonstrating a complete electronics chip-set utilizing PAM-4 technology and enabling a 56Gbps per lane data rate. This featured IP demonstrates another facet of MACOM’s advanced chipset solution for 200G and 400G optical connectivity in both parallel single mode fiber (PSM) and wave division multiplexing (WDM) applications.
MACOM said its technology demonstration at this week’s #OFC16 achieves industry leading transimpedance amplifier (TIA) sensitivity and low power, which enables the development of 200G QSFP and 400G MSA optical modules. On the transmit side, MACOM’s demonstration will feature a 28Gbaud linear driver and Clock and Data Recovery (CDR). The signal will be transmitted over single mode fiber, and recovered on the receiver side using MACOM’s 28Gbaud TIA and retimed with MACOM’s receiver CDR.
“MACOM has achieved excellent performance in silicon through its 28Gbaud PAM-4 chipset IP. This technology, along with recently announced L-PIC™ silicon photonics and our CW lasers, will enable next generation 200Gbs and 400Gbs solutions for small form-factor optics,” said Preet Virk, Senior Vice President and General Manager, Networks, MACOM.
