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Home » RAM Photonics Launches Scalable 2D Fiber Array for Optical Interconnects

RAM Photonics Launches Scalable 2D Fiber Array for Optical Interconnects

March 23, 2025
in Hot Start-ups, Optical
A A

RAM Photonics Industrial has announced the launch of its Medusa Array product family, a scalable 2D fiber array designed for next-generation optical interconnects. Manufactured using a fully automated, high-speed process with submicron precision, the Medusa™ Array eliminates manual assembly and testing traditionally required in photonics production. The solution delivers a scalable optical interface exceeding 1024 fiber ports with minimal insertion loss, addressing the growing demand for high-density, low-cost photonics-to-electronic interfaces in applications such as optical circuit switching (OCS) and co-packaged optics (CPO).

RAM’s automated process enables epoxy-free integration of custom 2D fiber arrays onto semiconductor or MEMS backplanes, bridging the gap between semiconductor manufacturing techniques and optical assembly. The Medusa™ platform allows customers to define custom geometries, collimation layers, and mixed fiber configurations while maintaining semiconductor-like production yields and cost efficiency. The technology directly targets expanding AI, data center (DC), and high-performance computing (HPC) infrastructure, where scaling photonic interfaces is essential to meeting bandwidth and efficiency demands.

The Medusa Array represents a major advancement in photonics manufacturing as RAM positions itself to serve hyperscale data centers and AI infrastructure providers seeking next-gen CPO and OCS solutions. The company will showcase the Medusa™ product line and its mass production capabilities at the upcoming OFC 2025 event in San Francisco.

• RAM Photonics launches Medusa™ Array, a scalable 2D fiber array exceeding 1024 ports.

• Fully automated, submicron-precision manufacturing eliminates manual assembly and testing.

• Medusa™ targets high-volume optical interfaces for OCS and co-packaged optics in AI, DC, and HPC markets.

• Supports custom geometries and mixed fiber types with semiconductor-grade yields and cost structures.

• RAM to present Medusa™ Array at OFC 2025 in San Francisco, April 1–3.

“RAM is proud to introduce the Medusa™ Array family of products to meet the growing photonic interface need in AI and DC infrastructure,” said John Marciante, CEO of RAM Photonics. “Our automated manufacturing platform ensures unmatched precision and industry record yields, positioning RAM as a leader in high-volume fiber interconnects.”

  • RAM Photonics Industrial, based in Rochester, New York, was founded by Dr. John Marciante, a leading expert in photonics and optical manufacturing, along with a team of engineers and executives with deep roots in the optics and semiconductor industries. The company focuses on automating photonics assembly to address key challenges in scaling optical interconnects for AI, data center, and high-performance computing markets. RAM Photonics has achieved notable milestones, including the development of its proprietary high-speed, submicron-precision manufacturing platform and now the commercial launch of its Medusa™ Array product family. The company is positioning itself as a critical supplier of next-generation optical interfaces for co-packaged optics (CPO) and optical circuit switching (OCS) applications.
Tags: OFC25
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