In Focus: Advanced Packaging

At the Intel Direct event in San Jose, Dr. Naga Chandrasekaran, EVP and GM of Intel Foundry Technology and Manufacturing, ...

Intel’s Q4 2024 results reflect a company in transition, with revenue of $14.3 billion, down 7% YoY, but exceeding expectations in gross margin and EPS ...

GlobalFoundries plans to establish the New York Advanced Packaging and Photonics Center at its Malta, New York, manufacturing facility. This ...

The U.S. Department of Commerce has announced the finalization of $1.4 billion in awards under the CHIPS National Advanced Packaging ...

The U.S. Department of Commerce has awarded Amkor Technology Arizona, Inc. up to $407 million under the CHIPS Incentives Program ...

The U.S. Department of Commerce has launched a new initiative under the CHIPS for America program, designed to strengthen domestic ...

Amkor Technology and TSMC agreed to collaborate on advanced semiconductor packaging and testing capabilities in Arizona. The agreement involves Amkor ...

The CHIPS Research and Development Office has unveiled plans for a major funding initiative aimed at revolutionizing semiconductor advanced packaging ...

Samsung Electronics has announced a significant partnership with Preferred Networks, a leading Japanese AI company, to provide cutting-edge semiconductor solutions. ...

SK hynix plans to invest an estimated $3.87 billion to build a state-of-the-art advanced packaging fabrication and R&D facility for ...

Intel celebrates the opening of Fab 9 in New Mexico, a crucial facility driving advancements in advanced packaging technologies for ...

The Chips for America program is investing $3 billion in the National Advanced Packaging Manufacturing Program to boost semiconductor leadership ...

Cadence Design Systems released its Integrity 3D-IC platform integrating 3D chip design planning, implementation and system analysis.Cadence says its platform ...