Broadcom has released the first XPU based on its 3.5D eXtreme Dimension System in Package (XDSiP) platform technology.
What is this and why is it a game-changer for next-generation XPUs?
Harish Bharadwaj, VP of Marketing, ASIC Product Division from Broadcom explains:
– Broadcom announces industry’s first 3D face-to-face technology-based custom XPU
– The technology enables integration of up to 6,000 mm of silicon and 12 HBM stacks in one packaged device
– Broadcom aims to take this technology to volume production in 2026
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