Ayar Labs Raises $500M to Scale CPO
Ayar Labs secured $500 million in Series E funding to accelerate high-volume production of its co-packaged optics (CPO) technology aimed at AI scale-up infrastructure. The round was led by Neuberger...
Semiconductors
Silicon solutions for data centers, network infrastructure, and CPE
Axelera Secures Major Funding of $450M for Edge AI Chips
Axelera AI raised a new funding round led by Innovation Industries, adding BlackRock and SiteGround Capital as new investors and bringing total capital raised to more than $450 million since...
SambaNova Unveils SN50 AI Chip, Secures $350M+, Partners with INTEL
SambaNova introduced its SN50 AI accelerator, a new chip designed to target high-performance inference for agentic AI workloads, while announcing a planned multi-year strategic collaboration with Intel and more than...
Taalas Bets on Per-Model Silicon to Cut AI Latency and Power
Toronto-based Taalas has emerged from stealth with more than $200 million in funding and introduced its first product, a hard-wired implementation of Llama 3.1 8B running on custom silicon. In a blog...
Ayar Labs Appoints Sankara Venkateswaran as VP of Engineering t
Ayar Labs named Sankara Venkateswaran as Vice President of Engineering, strengthening its leadership team as it pushes co-packaged optics (CPO) into high-volume production for hyperscale AI infrastructure. The San Jose–based...
Baya Systems and Aion Silicon Team on Chiplet-Ready SoC
Baya Systems and Aion Silicon announced a partnership to deliver an integrated solution aimed at accelerating complex SoC and chiplet-based semiconductor designs. The companies said the joint offering combines Baya’s...
Efficient Computer Raises $60M to Tackle AI’s Energy Constraint with Fabric Architecture
Efficient Computer centers its strategy on the Electron E1 processor, built on what it calls the Efficient Fabric architecture. The company describes the design as a spatial dataflow architecture that...
Tower Semiconductor Aligns SiPho Platform with Xanadu’s Photonic Quantum Roadmap
Xanadu and Tower Semiconductor expanded their strategic collaboration to advance silicon photonics manufacturing for fault-tolerant quantum computers. The companies are aligning Xanadu’s photonic quantum processor designs with Tower’s high-volume silicon photonics (SiPho) production...
Chiplet Summit 2026: UCIe Chair Debendra Das Sharma on the UCIe 3.0 Roadmap
Santa Clara, Calif. — Feb. 18, 2026 — At today’s Chiplet Summit 2026, Debendra Das Sharma, **Chair of the UCIe Consortium, laid out how Universal Chiplet Interconnect Express (UCIe) is evolving into the industry’s foundational...
Chiplet Summit 2026: Qualcomm on the New Foundation of Chiplets
Santa Clara, Calif. — Feb. 18, 2026 - At today’s Chiplet Summit 2026, AlphawaveSemi — now part of Qualcomm — underscored that connectivity has shifted from an enabler to the...
Chiplet Summit 2026 Best of Show Winners
The Chiplet Summit recognized three companies for technical innovation at its 2026 Best of Show Awards, held at the Santa Clara Convention Center. Organizers presented awards across design, interoperability, and...
Meta and NVIDIA Deepen Co-Design Across CPUs, GPUs and AI Networking
Meta is expanding its AI infrastructure through a multiyear, multigenerational partnership with NVIDIA, deploying millions of Blackwell and Rubin GPUs alongside NVIDIA CPUs and Spectrum-X networking across its global data center...
GlobalFoundries, Renesas Deepen U.S. Chip Manufacturing Pact
GlobalFoundries and Renesas Electronics have expanded their long-standing relationship into a multi-billion-dollar manufacturing agreement aimed at strengthening U.S. semiconductor production and reinforcing automotive and industrial supply chains. The companies will...
A private dossier for networking and telecoms