Silicon for AI, Cloud, Telecom and Digital Infrastructure Converge Digest tracks the semiconductor platforms powering next-generation networks, AI clusters, optical systems, data centers, wireless infrastructure and edge devices. |
Silicon Pillars AI AcceleratorsNetworking SiliconOptical DSPsChipletsMemorySilicon PhotonicsWireless SoCs |
| Tracking: Tapeouts • Process Nodes • Packaging • Foundry Partnerships • AI Inference • Ethernet Switching • Coherent Optics • Memory Bandwidth • Power Efficiency • Supply Chain |
Sequoia Capital is backing a new semiconductor startup, Nuvacore, that has just emerged from stealth with plans to develop a general-purpose CPU architecture optimized for AI-era workloads. The company positions...
Teradyne announced the acquisition of TestInsight, a provider of semiconductor test development and validation software, to strengthen its position in design-to-test workflows for AI and data center devices. Financial terms...
Broadcom notched another major hyperscaler design win as Meta expanded its partnership to co-develop multiple generations of MTIA (Meta Training and Inference Accelerator) silicon, deepening Broadcom’s role across chip design, advanced packaging,...
Rebellions, Arm, and SK Telecom announced a joint initiative to develop AI inference infrastructure tailored for sovereign AI and telecommunications data center environments. The collaboration centers on integrating Arm’s forthcoming AGI CPU—its first...
Intel and Google expanded a multiyear collaboration aimed at the next phase of AI and cloud infrastructure, with Intel Xeon CPUs continuing to power parts of Google Cloud and the...
SiFive secured $400 million in an oversubscribed Series G funding round to accelerate development of high-performance RISC-V CPU and AI IP targeting data center deployments. The round, led by Atreides Management, included...
Altera announced plans to extend lifecycle support for its Agilex, MAX 10, and Cyclone V FPGA families through 2045, targeting customers deploying long-lived infrastructure across industrial, aerospace, communications, and transportation sectors....
Coherent Corp. introduced new silicon carbide (SiC) thick epitaxy capabilities designed to support power devices operating up to 10kV, targeting next-generation AI data centers and high-voltage industrial systems. The announcement reflects...
SambaNova Systems and Intel unveiled a production-scale heterogeneous AI infrastructure design that combines GPUs, SambaNova RDUs, and Intel Xeon 6 CPUs to address the performance bottlenecks emerging in agentic AI workloads. The...
Intel Foundry presented a 300 mm gallium nitride (GaN)-on-silicon chiplet platform at the IEEE International Electron Devices Meeting (IEDM) 2025, highlighting an ultra-thin GaN chiplet with a 19 micrometer silicon base and...
Applied Materials introduces new deposition systems targeting angstrom-era logic nodes, as chipmakers transition to Gate-All-Around (GAA) transistor architectures at 2nm and beyond. The company unveiled its Precision™ Selective Nitride PECVD...
Intel confirmed its participation in the emerging “Terafab” initiative alongside SpaceX, xAI, and Tesla, signaling early alignment between leading compute, AI, and manufacturing players around next-generation silicon production. The confirmation came via a statement...
Broadcom and Google have signed long-term agreements covering custom AI processors and rack-level infrastructure, extending their collaboration on hyperscale AI systems through 2031. The deals formalize Broadcom’s role in both...
A private dossier for networking and telecoms