Diabolocom, a global provider of cloud-based contact center software and voice AI solutions, has selected Ribbon Communications' high-density Data Center ...

Marvell released a 1.6 Tbps transimpedance amplifier (TIA) and laser driver chipset, enabling 800 Gbps and 1.6 Tbps linear-drive pluggable ...

Marvell unveiled the Aquila DSP, the first coherent-lite DSP optimized for 1.6 Tbps O-band optical interconnects. Designed for data center ...

Marvell introduced a custom high-bandwidth memory (HBM) compute architecture designed to optimize XPUs for cloud AI accelerators. This innovation delivers ...

The U.S. Department of Commerce has awarded Micron Technology up to $6.165 billion under the CHIPS Act to expand advanced ...

IBM has introduced a new co-packaged optics (CPO) technology that integrates polymer optical waveguides (PWG) to replace electrical interconnects inside ...

Nokia has enhanced its data center fabric solution with support for SONiC (Software for Open Networking in the Cloud), an ...

Sparkle signed a Memorandum of Understanding (MoU) with Italy’s National Institute of Geophysics and Volcanology (INGV) to leverage submarine fibre ...

VIAVI Solutions confirmed its critical role in validating the world’s first 800GbE transatlantic service trial, originally announced in October by ...

MIXI upgraded its communications and gaming network by deploying PacketLight’s PL-4000M Muxponder, achieving a 300G capacity boost between Tokyo and ...

Tejas Networks has signed a three-year agreement with Vodafone Idea Limited (VIL) to supply its TJ1400 and TJ1600 packet and ...

Kioxia Corporation and Nanya Technology unveiled a jointly developed DRAM technology, OCTRAM (Oxide-Semiconductor Channel Transistor DRAM), during the IEEE International ...

Rambus Inc. announced a five-year extension of its comprehensive patent license agreement with Micron Technology, continuing their long-standing collaboration. The ...