Sivers Semiconductors has entered a strategic OEM agreement with O-Net Technologies to develop high-performance external laser sources that will power the next wave of Co-Packaged Optics (CPO) in AI-driven data centers. Under the partnership, O-Net will integrate Sivers’ advanced Distributed Feedback (DFB) laser arrays into its External Laser Small Form Factor (ELSFP) optical modules, enabling greater scalability, lower power consumption, and higher performance in GPU-heavy environments.
The collaboration is aimed at supporting large-scale AI clusters where traditional pluggable transceiver solutions are increasingly challenged by thermal and bandwidth constraints. The Sivers-enabled ELSFP modules are designed for seamless deployment in CPO applications across switches and network interface cards, offering a power-efficient alternative to traditional optics for hyperscale and AI infrastructure.
• Sivers’ advanced DFB laser arrays to be integrated into O-Net’s next-generation ELSFP optical modules
• ELSFP modules are optimized for Co-Packaged Optics (CPO) applications in switches and NICs
• Significantly reduces power consumption compared to pluggable transceivers
• Supports large-scale scale-up/scale-out AI factory deployments with millions of GPUs
• Collaboration targets growing demand for energy-efficient, high-capacity optical networking
Vickram Vathulya, CEO of Sivers Semiconductors: “By combining our expertise in high-performance laser solutions with O-Net’s strong presence in optical networking, we are advancing the future of high-speed optical networking with cutting-edge photonic solutions.”
