• Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Sunday, June 22, 2025
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » LiquidStack Brings High Density Direct-to-Chip Cooling

LiquidStack Brings High Density Direct-to-Chip Cooling

June 3, 2025
in Data Centers
A A

LiquidStack has introduced the GigaModular™ CDU, a scalable coolant distribution unit designed to meet the rising demand for high-density, direct-to-chip liquid cooling in AI and cloud data centers. Engineered for flexibility and performance, the GigaModular supports up to 10MW of heat load with a pay-as-you-grow design that simplifies deployment and future expansion.

Targeting next-generation compute platforms like NVIDIA’s B300 and GB300, the GigaModular addresses the escalating heat densities that are quickly surpassing 120kW per rack, with projections of up to 600kW by 2027. The unit features a modular pump and control architecture, centralized instrumentation for precise monitoring, and a compact footprint that allows for wall-adjacent installation. Key components include high-efficiency IE5 pumps, dual 25μm strainers for component protection, and a front-access design to streamline servicing.

The GigaModular CDU is offered in configurations ranging from 2.5MW to 10MW and can be delivered as a pre-integrated skid-mounted system or in cabinet modules for on-site assembly. Production will begin at LiquidStack’s facility in Carrollton, Texas, with customer quoting available starting September 2025.

  • Modular CDU supports 2.5MW to 10MW direct-to-chip liquid cooling
  • Engineered for AI workloads with projected rack densities up to 600kW
  • Includes IE5 high-efficiency pump modules and dual filtration for reliability
  • Compact design requires only front access for maintenance and placement flexibility
  • Available in skid-mounted or cabinet-based assembly options

“With up to 10MW of cooling capacity at N, N+1, or N+2, the GigaModular is a platform like no other—we designed it to be the only CDU our customers will ever need,” said Joe Capes, CEO of LiquidStack.

  • LiquidStack, headquartered in Carrollton, Texas, is a leading provider of advanced liquid cooling solutions for data centers, including two-phase immersion and single-phase direct-to-chip technologies. Originally founded in 2012 in Hong Kong as Allied Control and acquired by Bitfury in 2015, the company was spun out and rebranded as LiquidStack in 2021. CEO Joe Capes, formerly of Schneider Electric and Coolcentric, leads the company with a focus on sustainable, high-efficiency cooling for AI and high-performance computing workloads. LiquidStack holds multiple patents in thermal management and operates a 20,000-square-foot R&D and manufacturing facility in Carrollton. Backed by strategic investors including Wiwynn and Tiger Global, the company has raised over $45 million to date and developed a broad product portfolio that includes the GigaModular™ CDU, DataTank™, and EdgeTank™ platforms.
ShareTweetShare
Previous Post

HPE Q2 Revenue Hits $7.6B, Led by Hybrid Cloud and Intelligent Edge

Next Post

Furukawa and Lightera Debut Precision Splicer for Hollow-Core, Multi-Core Fibers

Related Posts

Australia’s nbn hits new traffic peak – 26.76 Tbps
All

NTIA Overhauls $42.5B BEAD Aiming to Accelerate Broadband Rollouts

June 21, 2025
Brightspeed Adds $575M to Fuel XGS-PON Rollout
Last Mile / Middle Mile

Brightspeed Adds $575M to Fuel XGS-PON Rollout

June 21, 2025
ECOC24: Polariton Achieves 400 Gbps Per Lane
5G / 6G / Wi-Fi

OKI, NTT Aim for Terahertz Devices for 6G and Sensing

June 21, 2025
Huawei Pushes F5.5G All-Optical Access Networks
Last Mile / Middle Mile

Huawei Pushes F5.5G All-Optical Access Networks

June 21, 2025
RUCKUS Expands Wi-Fi 7 Portfolio with New Hospitality-Focused APs
5G / 6G / Wi-Fi

RUCKUS Expands Wi-Fi 7 Portfolio with New Hospitality-Focused APs

June 21, 2025
Intel’s Q3 data center revenue dropped 27% yoy
Semiconductors

Intel Expands AI and SoC Engineering 

June 21, 2025
Next Post
Kinetic Reports Vandalism of Fiber Cables in Kentucky

Furukawa and Lightera Debut Precision Splicer for Hollow-Core, Multi-Core Fibers

Categories

  • 5G / 6G / Wi-Fi
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Financials
  • Last Mile / Middle Mile
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Security Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version