Semiconductors

Marvell Chairman and CEO Matt Murphy used his COMPUTEX keynote in Taiwan to argue that the next defining bottleneck in AI infrastructure is no longer compute or memory alone, but...

Atomera announced new test results showing that its Mears Silicon Technology (MST) can address a longstanding challenge that has limited the adoption of gallium nitride (GaN) devices on silicon substrates...

GlobalFoundries (GF) has joined the U.S. Department of Energy’s Genesis Mission as an industry partner, providing researchers with direct access to semiconductor manufacturing resources intended to accelerate the transition from...

xLight has finalized a $150 million award under the U.S. CHIPS and Science Act to support construction and demonstration of its first free-electron laser (FEL) system for semiconductor manufacturing. The...

Marvell introduced its Teralynx T100, a 102.4 Tbps Ethernet switch silicon platform aimed squarely at the rapidly growing AI infrastructure market. The company says the device is the industry’s first...

XCENA raised $135 million in Series B funding to expand deployment of its memory-centric computing platform for AI infrastructure. The round brings total funding to $185 million and values the...

FuriosaAI announced a strategic partnership with Broadcom to develop a third-generation AI accelerator platform built around a multi-die chiplet architecture optimized for large-scale inference workloads. The collaboration combines FuriosaAI’s Tensor...

Broadcom introduced a fixed wireless access reference platform with Samsung Electronics that combines Broadcom’s BCM6776 Wi-Fi 8 SoC with Samsung’s B1320 5G modem. The platform targets global FWA gateways and...

Broadcom introduced the BCM68850, a 50G ITU-PON home gateway SoC with an integrated neural processing unit and native Wi-Fi 8 compatibility, targeting the next generation of fiber broadband gateways. The...

Amkor Technology is expanding its U.S. advanced packaging footprint with the acquisition of an additional 67-acre parcel adjacent to its semiconductor packaging and test campus in Peoria, Arizona. The move...

Broadcom will join Applied Materials’ EPIC (Equipment and Process Innovation and Commercialization) platform as an innovation partner focused on accelerating advanced semiconductor packaging technologies for next-generation AI systems. The collaboration...

Credo and Rebellions are partnering to integrate Credo’s ZeroFlap active electrical cables (AECs) into Rebellions’ RebelPOD AI inference clusters, targeting enterprises building scalable AI inference infrastructure. The companies said the...

Analog Devices announced plans to acquire Empower Semiconductor in a $1.5 billion all-cash transaction aimed at strengthening its position in high-density power delivery systems for AI infrastructure. The deal expands...